SE97 datasheet(5/53 Pages) NXP

Part #	SE97

Description	DDR memory module temp sensor with integrated SPD, 3.3 V

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Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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SE97_6

Product data sheet

Rev. 06 — 17 August 2009

5 of 53

NXP Semiconductors

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

6.

Pinning information

6.1 Pinning

6.2 Pin description

Fig 2.

Pin conﬁguration for TSSOP8

Fig 3.

Pin conﬁguration for HXSON8

Fig 4.

Pin conﬁguration for HVSON8

Fig 5.

Pin conﬁguration for HWSON8

SE97PW

A0

VDD

A1

EVENT

A2

SCL

VSS

SDA

002aab805

1

2

3

4

6

5

8

7

terminal 1

index area

1

A0

SE97TL

002aad548

Transparent top view

2

A1

3

A2

4

8

7

6

5

VSS

VDD

EVENT

SCL

SDA

002aab803

SE97TK

SDA

A2

VSS

SCL

A1

EVENT

A0

VDD

Transparent top view

4

5

3

6

2

7

1

8

terminal 1

index area

terminal 1

index area

1

A0

SE97TP

002aad768

Transparent top view

2

A1

3

A2

4

8

7

6

5

VSS

VDD

EVENT

SCL

SDA

Table 2.

Pin description

Symbol

Type

Description

A0

1

I

I2C-bus/SMBus slave address bit 0 with internal pull-down. This

input is overvoltage tolerant to support software write protection.

A1

2

I

I2C-bus/SMBus slave address bit 1 with internal pull-down

A2

3

I

I2C-bus/SMBus slave address bit 2 with internal pull-down

VSS

4

ground

device ground

SDA

5

I/O

SMBus/I2C-bus serial data input/output (open-drain). Must have

external pull-up resistor.

SCL

6

I

SMBus/I2C-bus serial clock input/output (open-drain). Must have

external pull-up resistor.

EVENT

7

O

Thermal alarm output for high/low and critical temperature limit

(open-drain). Must have external pull-up resistor.

VDD

8

power

device power supply (3.0 V to 3.6 V); supports 1.7 V for

EEPROM read only.

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