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MPXV5050DP Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc |
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MPXV5050DP Datasheet(HTML) 5 Page - Freescale Semiconductor, Inc |
5 / 18 page MPX5050 Sensors Freescale Semiconductor 5 Pressure On-chip Temperature Compensation and Calibration Figure 3 illustrates the Differential/Gauge Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX5050/MPXV5050G series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0× to 85×C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 2. Output vs. Pressure Differential Figure 3. Cross-Sectional Diagram (not to scale) Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) Differential Pressure (kPa) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 5 10 15 20 25 30 35 40 45 55 50 Transfer Function: Vout = VS*(0.018*P+0.04) ± ERROR VS = 5.0 Vdc TEMP = 0 to 85°C TYPICAL MIN MAX Fluorosilicone Gel Die Coat Wire Bond Die P1 Stainless Steel Metal Cover Lead Frame Die Bond Epoxy Plastic Case P2 Differential/Gauge Element +5 V 1.0 μF 0.01 μF 470 pF GND Vs Vout IPS OUTPUT |
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