MAX9934TAUA+T datasheet(2/22 Pages) MAXIM

Part #	MAX9934TAUA+T

Description	High-Precision, Low-Voltage, Current-Sense Amplifier with Current Output and Chip Select for Multiplexing

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Manufacturer	MAXIM [Maxim Integrated Products]

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High-Precision, Low-Voltage, Current-Sense Amplifier

with Current Output and Chip Select for Multiplexing

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VCC = 3.3V, VRS+ = VRS- = 3.0V, VSENSE = 0, VCM = (VRS+ + VRS-)/2, VCS = 3.3V, ROUT = 10kΩ to GND for unidirectional operation,

ROUT = 10kΩ to VCC/2 for bidirectional operation. TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.)

(Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

RS+, RS- to GND......................................................-0.3V to +6V

VCC to GND ..............................................................-0.3V to +4V

CS, OUT to GND (VCC = 0, or CS < VIL)..................-0.3V to +4V

OUT to GND (CS > VIH)................................-0.3V to VCC + 0.3V

Differential Input Voltage (RS+ - RS-) ....................................±6V

Output Short-Circuit Current Duration

OUT to GND or VCC ...............................................Continuous

Continuous Input Current into Any Terminal.....................±20mA

Continuous Power Dissipation (TA = +70°C)

8-Pin µMAX (derate multilayer 4.8mW/°C

above +70°C).............................................................388mW

Junction-to-Ambient Thermal Resistance (

θJA)

(Note 1) ....................................................................206°C/W

Junction-to-Case Thermal Resistance (

θJC)

(Note 1) ......................................................................42°C/W

6-Pin µDFN (derate multilayer 4.5mW/°C

above +70°C)..........................................................357.8mW

Junction-to-Ambient Thermal Resistance (

θJA)

(Note 1 ) ................................................................223.6°C/W

Junction-to-Case Thermal Resistance (

θJA)

(Note 1) ....................................................................122°C/W

6-Bump UCSP (derate multilayer 3.9mW/°C

above +70°C).............................................................308mW

Junction-to-Ambient Thermal Resistance (

θJA)

(Note 1) ....................................................................260°C/W

Operating Temperature Range .........................-40°C to +125°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +160°C

Lead Temperature (soldering, 10s) .................................+300°C

Reflow Soldering Temperature (UCSP, µDFN, and

µMAX) ..........................................................................+260°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC CHARACTERISTICS

TA = +25°C

±10

MAX9934T

-40°C

≤ TA ≤ +125°C

±14

TA = +25°C

±10

Input Offset Voltage (Note 3)

VOS

MAX9934F

-40°C

≤ TA ≤ +125°C

±20

µV

MAX9934T

±60

Input Offset Voltage Drift (Note 3)

VOS/dT

MAX9934F

±90

nV/°C

Common-Mode Input Voltage

Range (Average of VRS+ and

VRS-) (Note 3)

CMVR

Guaranteed by CMRR2

-0.1

+5.5

V

TA = +25°C

128

134

0

≤ VCM ≤ VCC -

0.2V (MAX9934F)

-40°C

≤ TA ≤ +125°C

112

TA = +25°C

128

135

CMRR1

0

≤ VCM ≤ VCC -

0.2V (MAX9934T)

-40°C

≤ TA ≤ +125°C

109

TA = +25°C

119

125

-0.1

≤ VCM ≤ 5.5V

(MAX9934F)

-40°C

≤ TA ≤ +125°C

104

TA = +25°C

98

113

Common-Mode Rejection Ratio

(Note 3)

CMRR2

-0.1

≤ VCM ≤ 5.5V

(MAX9934T)

-40°C

≤ TA ≤ +125°C

98

dB

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

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