ABSOLUTE MAXIMUM RATINGS

THERMAL CHARACTERISTICS

DAC5689

TERMINAL FUNCTIONS (continued)

TERMINAL

I/O

DESCRIPTION

NAME

NO.

Transmit enable input. Internal pull-down. TXENABLE must be high for the DATA to the DAC to be

TXENABLE

6

I

enabled. When TXENABLE is low, the digital logic section is forced to all 0, and any input data is

ignored.

Digital supply voltage. (1.8V) This supply pin is also used for factory fuse programming. Connect to

VFUSE

44

I

DVDD pins for normal operation.

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

Supply voltage range

–0.5 to 2.3

V

–0.5 to 2.3

V

–0.5 to 2.3

V

–0.5 to 4

V

–0.5 to 4

V

Supply voltage range

AVDD to DVDD

–2 to 2.6

V

CLKVDD to DVDD

–0.5 to 0.5

V

IOVDD to AVDD

–0.5 to 0.5

V

–0.5 to CLKVDD + 0.5

V

–0.5 to IOVDD + 0.5

V

–0.5 to IOVDD + 0.5

V

–0.5 to IOVDD + 0.5

V

–0.5 to AVDD + 0.5

V

–0.5 to AVDD + 0.5

V

Peak input current (any input)

20 mA

mA

Peak total input current (all inputs)

–30 mA

mA

–40 to 85

°C

Storage temperature range

–65 to 150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of these or any other conditions beyond those indicated under recommended operating conditions is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Measured with respect to GND.

over operating free-air temperature range (unless otherwise noted)

THERMAL CONDUCTIVITY

64ld QFN

UNIT

125

°C

Theta junction-to-ambient (still air)

22

θ

JA

°C/W

Theta junction-to-ambient (150 lfm)

15

ψ

JT

Psi junction-to-top of package

0.2

°C/W

θ

JB

Theta junction-to-board

3.5

°C/W

(1)

Air flow or heat sinking reduces

θ

(2)

It is strongly recommended to solder the device thermal pad to the board ground plane.

4

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