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TPS54326PWPR Datasheet(PDF) 2 Page - Texas Instruments |
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TPS54326PWPR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 22 page TPS54326 SLVSA13A – OCTOBER 2009 – REVISED OCTOBER 2009 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) TRANSPORT TA PACKAGE (2) (3) ORDERABLE PART NUMBER MEDIA, QUANTITY TPS54326PWP Tube PowerPAD™ –45°C to 85°C (HTSSOP) – PWP (14 Pins) TPS54326PWPR Tape and Reel, 3000 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (3) All package options have Cu NIPDAU lead/ball finish. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT VIN, VCC, EN –0.3 to 20 V VBST –0.3 to 26 V VBST (vs SW1, SW2) –0.3 to 6.5 V VI Input voltage range VFB, VO, SS, PG –0.3 to 6.5 V SW1, SW2 –2 to 20 V SW1, SW2 (10 ns transient) –3 to 20 V VREG5 –0.3 to 6.5 V VO Output voltage range PGND1, PGND2 –0.3 to 0.3 V Vdiff Voltage from GND to POWERPAD –0.2 to 0.2 V Human Body Model (HBM) 2 kV ESD rating Electrostatic discharge Charged Device Model (CDM) 500 V TJ Operating junction temperature –40 to 150 °C Tstg Storage temperature –55 to 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATINGS (1) (2 oz. trace and copper pad with solder) TA = 25°C TA = 85°C PACKAGE θJA POWER RATING POWER RATING PWP 44.5°C/W 2.25 W 0.9 W (1) Rating based on JEDEC high thermal conductivity (High K) board with 2 x 2 arrays of thermal vias. See Texas Instruments application report (SLMA002) regarding thermal characteristic of the PowerPAD™ package. 2 Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS54326 |
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