Introduction to Circuit Protection

Introduction to Circuit Protection

Transientology

2

© 2009 Littelfuse, Inc.

Specifications are subject to change without notice.

Subminiature Fuses

808 Series

Please refer to www.littelfuse.com/series/808.html for current information.

Average Time Current Curves

Temperature Derating Curve

Soldering Parameters - Wave Soldering

0

20

40

60

80

100

120

140

160

180

200

220

240

260

280

300

Time (Seconds)

Preheat Time

Cooling Time

Dwell Time

Wave Parameter

Lead-free Recommendation

Preheat:

100

150

Solder PotTemperature:

260

Solder DwellTime:

Recommended Hand-Solder Parameters:

Note: These devices are not recommended for IR or

Convection Reflow process.

Recommended Process Parameters:

25°C

0

20

40

60

80

100

120

140

-60

-20

20

60

100

140

AMBIENT TEMPERATURE ( )

0.001

0.01

0.1

1

10

100

1

10

100

1000

CURRENT IN AMPERES