3

3 - 229

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Pad Number

Function

Description

Interface Schematic

1RFIN

This pad is AC coupled

and matched to 50 Ohms.

2, 3

Vgg1, Vgg2

Gate control for amplifier. Please follow “MMIC Amplifier Bias-

ing Procedure” application note. See assembly for required

external components.

4RFOUT

This pad is AC coupled

and matched to 50 Ohms.

5, 6

Vdd1, Vdd2

Power Supply Voltage for the amplifier. See assembly for

required external components.

Die Bottom

GND

Die bottom must be connected to RF/DC ground.

Pad Descriptions

HMC-AUH317

v03.0209

GaAs HEMT MMIC MEDIUM POWER

AMPLIFIER, 81 - 86 GHz

Application Circuit