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GM6603-ATA3T Datasheet(PDF) 7 Page - Gamma Microelectronics Inc. |
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GM6603-ATA3T Datasheet(HTML) 7 Page - Gamma Microelectronics Inc. |
7 / 11 page 7 GM6603 3.0A LOW DROPOUT PRECISION REGULATOR (a) Fixed version (b) Adjustable version Conductor Parasitic Resistance R C V IN V OUT GM6603-3.3 GND RLOAD Conductor Parasitic Resistance R C V IN V OUT GM6603-A ADJ RLOAD R1 R2 Output Voltage Sensing GM6603 series is a three-terminal regulator, so it cannot provide true remote load sensing. Load regulation is limited by the resistance of the conductors connecting the regulator to the load. For best results, GM6603 should be connected as shown 1n F1gure 2. Calculating Power Dissipation and Heat Sink Requirements GM6603 series include thermal shutdown and current limit circuitry to protect the devices. However, high power regulators normally operate at high junction temperatures so it is important to calculate the power dissipation and junction temperatures accurately to be sure to use an adequate heat sink. The case is connected to VOUT on GM6603, so electrical isolation may be required for some applicat1ons. Thermal compound should always be used with high current regulators like GM6603. The thermal characteristics of an IC depend on four factors: 1. Maximum Ambient Temperature TA (°C) 2. Power Dissipation PD (Watts) 3. Maximum Junction Temperature TJ (°C) 4. Thermal Resistance Junction to amb1ent θJA The relationship of these four factors is expressed by equation (1): TJ = TA + PD x θJA Maximum ambient temperature and power dissipation are determ1ned by the design while the maximum junction temperature and thermal resistance depend on the manufacturer and the package type. The maximum power dissipation for a regulator is expressed by equation (2): PD(MAX) = (VIN(MAX) – VOUT(MIN) ) x IOUT(MIN) + VIN(MIN) x IQ where: VIN(MAX) is the maximum input voltage, VOUT(MIN) is the minimum output voltage, IOUT(MAX) is the maximum output current IQ is the max1mum quiescent current at IOUT(MAX). A heat sink effect1vely increases the surface area of the package to improve the flow of heat away from the IC into the air. Each material in the heat flow path between the IC and the environment has a thermal resistance. Like series electrical resistances, these resistance are summed to determine θJA, the total thermal resistance between the junction and the air. This is expressed by equation (3): θ JA = θJC + θCS + θSA where: θJC is the thermal resistance of Junction to Case, θCS is the thermal resistance of Case to Heat Sink, θSA is the thermal resistance of Heat Sink to Ambient air. The value for θJA is calculated using equation (3) and the result can be substituted in equation (1). The value for θCS is 3.5°C/W for a given package typed based on an average d1ie size. For a high current regulator such as GM6603, the majority of the heat is generated in the power transistor sect1on. Figure 1. Conductor Parasitic Resistance Effects are Minimized by this Grounding Scheme. |
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