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GM6251-3.2T92B Datasheet(PDF) 7 Page - Gamma Microelectronics Inc.

Part # GM6251-3.2T92B
Description  300mA ULTRA LOW DROPOUT POSITIVE VOLTAGE REGULATOR
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Manufacturer  GAMMA [Gamma Microelectronics Inc.]
Direct Link  http://www.gammamicro.com.tw/
Logo GAMMA - Gamma Microelectronics Inc.

GM6251-3.2T92B Datasheet(HTML) 7 Page - Gamma Microelectronics Inc.

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GM6251
300mA ULTRA LOW DROPOUT
POSITIVE VOLTAGE REGULATOR
Application Note
Notes on Usage
1.
It is recommended to operate the GM6251 series within the stipulated absolute maximum ratings
as the IC is liable to malfunction it is operated outside the ratings.
2.
There is a possibility of heat or oscillation as a result of the impedance present between the
power supply and the IC's input. Where impedance is greater 10Ω, it is recommend to use a
capacitor (CIN) of at least 1µF at the input terminal.
3.
With a large output current, operations can be stabilized by increasing capacitor size (CIN). If CIN
is too small and capacitance of (CL) is increased, there is a possibility of oscillation due to input
impedance. In such case, operation can be stabilized by either increasing the size of CIN or
decreasing the size of CL.
4.
Please ensure the output current (IOUT) is less than Pd ÷ (VIN - VOUT) and does not exceed the
stipulated continuous for total power dissipation value (Pd) for the package.
CALCULATING POWER DISSIPATION
The GM6251 series precision linear regulators include thermal shutdown and current limit circuitry to
protect the devices. However, high power regulators normally operate at high junction temperatures so
it is important to calculate the power dissipation and junction temperatures accurately to be sure that
you use and adequate heat sink.
The thermal characteristics of an IC depend four factors:
1.
Maximum Ambient Temperature T
A ()
2.
Power Dissipation P
D (Watts)
3.
Maximum Junction Temperature T
J ()
4.
Thermal Resistance Junction to ambient R
JA (℃/W)
These relationship of these four factors is expressed by equation : T
J = TA + PD X RJA
Maximum ambient temperature and power dissipation are determined by the design while the
maximum junction temperature and thermal resistance depend on the manufacturer and the package
type.


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