CPC5710N

10

www.clare.com

R02

4.2 Soldering

For proper assembly, the component must be

processed in accordance with the current revision of

IPC/JEDEC standard J-STD-020. Failure to follow the

recommended guidelines may cause permanent

damage to the device resulting in impaired

performance and/or a reduced lifetime expectancy.

4.3 Washing

Clare does not recommend ultrasonic cleaning of this

part.

RoHS

2002/95/EC

Pb

For additional information please visit www.clare.com

Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make

changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set

forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its

products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into

the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a

person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-CPC5710 - R02

© Copyright 2008, Clare, Inc.

All rights reserved. Printed in USA.

8/7/08