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ICS843S1066 Datasheet(PDF) 8 Page - Integrated Device Technology |
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ICS843S1066 Datasheet(HTML) 8 Page - Integrated Device Technology |
8 / 12 page ICS843S1066 CRYSTAL-TO-3.3V LVPECL CLOCK SYNTHESIZER IDT™ / ICS™ 3.3V LVPECL CLOCK SYNTHESIZER 8 ICS843S1066CG REV. A AUGUST 27, 2008 Power Considerations This section provides information on power dissipation and junction temperature for the ICS843S1066. Equations and example calculations are also provided. 1. Power Dissipation. The total power dissipation for the ICS843S1066 is the sum of the core power plus the power dissipated in the load(s). The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results. NOTE: Please refer to Section 3 for details on calculating power dissipated in the load. • Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 53mA = 183.6mW • Power (outputs)MAX = 32mW/Loaded Output pair Total Power_MAX (3.3V, with all outputs switching) = 183.65mW + 32mW = 215.6mW 2. Junction Temperature. Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The maximum recommended junction temperature for HiPerClockS devices is 125°C. The equation for Tj is as follows: Tj = θ JA * Pd_total + TA Tj = Junction Temperature θ JA = Junction-to-Ambient Thermal Resistance Pd_total = Total Device Power Dissipation (example calculation is in section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θ JA must be used. Assuming no air flow and a multi-layer board, the appropriate value is 115.2°C/W per Table 7 below. Therefore, Tj for an ambient temperature of 70°C with all outputs switching is: 70°C + 0.216W * 115.2°C/W = 94.9°C. This is well below the limit of 125°C. This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of board. Table 7. Thermal Resistance θJA for 8 Lead TSSOP, Forced Convection θ JA by Velocity Meters per Second 01 2.5 Multi-Layer PCB, JEDEC Standard Test Boards 115.2°C/W 110.9 108.8 |
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