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EUP7903-15VIR1 Datasheet(PDF) 9 Page - Eutech Microelectronics Inc |
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EUP7903-15VIR1 Datasheet(HTML) 9 Page - Eutech Microelectronics Inc |
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9 / 10 page  EUP7903 DS7903 Ver 1.0 Nov. 2008 9 0 25 50 75 100 125 150 0.0 0.1 0.2 0.3 0.4 0.5 0.6 Ambient Temperature( oC) SOT23-5 Output capacitor The EUP7903 is designed specifically to work with very small ceramic output capacitors. A 1uF to 10uF capacitor with 5mΩ to 500mΩ ESR range is suitable for the most EUP7903 applications. The ESR of a typical 1uF ceramic capacitor is around 20mΩ, which easily meets the ESR requirement for stability. Capacitor characteristics More consideration should be taken when selecting the capacitor because its capacitance can vary with temperature. The capacitor type X7R or X5R, which operates over a temperature range of -40 to + ℃ 85 , will ℃ only vary within ±15%. However Z5U or T5V temperature characteristics. Their capacitance can drop by more than 50% as the temperature goes from 25℃ to 85℃. Therefore the capacitor type X7R or X5R is recommended in applications where the ambient temperature will change significantly above or below 25 . ℃ No load Stability The EUP7903 will remain stable and in regulation with no external load. This is special important in CMOS RAM keep-alive applications. Thermal Considerations Thermal protection limits power dissipation in EUP7903.When the device junction temperature exceeds 155°C, the OTP circuit starts the thermal shutdown function and turns the pass transistor off. The pass transistor turns on again after the junction temperature cools down 30°C. For continuous operation, do not exceed absolute maximum junction temperature 150°C. The power dissipation definition in device is: (EQ.3) The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction and ambient. The maximum power dissipation can be calculated by following formula : (EQ.4) Where TJ(MAX) is the maximum operation junction temperature 125°C, TA is the ambient temperature and the θJA is the junction to ambient thermal resistance. For recommended operating conditions specification of EUP7903, where TJ(MAX) is the maximum junction temperature of the die (125°C) and TA is the operated ambient temperature. The junction to ambient thermal resistance θJA is layout dependent. For SOT-23-5 package, the thermal resistance θJA is 220°C/W on the standard thermal test board. The maximum power dissipation at TA = 25°C can be calculated by following formula : (EQ.5) for SOT23-5 package The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. For EUP7903 packages, the Figure 5 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed. Figure. 5. Power Dissipation for EUP7903 Package The EUP7903 is available in the SOT23-5 package. JA A ) MAX ( J ) MAX ( D ) T T ( P θ − = Q IN OUT OUT IN D I V I ) V V ( P × + × − = W 445 . 0 220 / ) C 25 C 125 ( P ) MAX ( D = ° − ° = |
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