9

4657G–AUTO–09/09

T2525

7.

Chip Dimensions

Figure 7-1.

Chip Size in µm

Note:

Pad coordinates are for lower left corner of the pad in µm from the origin 0,0

Note:

Value depends on manufacture location.

Dimensions

Length inclusive scribe

1.15 mm

Width inclusive scribe

1.29 mm

Thickness

290µ ± 5%

Pads

90µ

× 90µ

Fusing pads

70µ

× 70µ

Pad metallurgy

Material

Thickness

0.8 µm

Finish

Material

Si

Thickness

0.7/0.3 µm

0,0

1130,1030

scribe

width

T2525

351,904

63,70

63,660

723,885

Fusing

IN

GND

OUT

VS