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HI-1579PCIF Datasheet(PDF) 9 Page - Holt Integrated Circuits |
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HI-1579PCIF Datasheet(HTML) 9 Page - Holt Integrated Circuits |
9 / 10 page PACKAGE DIMENSIONS 20-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB (Wide Body, Thermally Enhanced) inches (millimeters) Package Type: 20HWE BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) Electrically isolated heat sink pad on bottom of package. Connect to any ground or power plane for optimum thermal dissipation. Detail A .504 ± .008 (12.79 ± .19) .295 ± .002 (7.493 ± .05) 0° to 8° .090 ± .01 (2.29 ± .25) .205 (5.21) .290 (7.37) Bottom View Top View .407 ± .013 (10.325 ± .32) .033 ± .017 (.838 ± .432) .0075 ± .004 (.191 ± .089) .0165 ± .0035 (.419 ± .089) .050 (1.27) BSC See Detail A typ typ .0105 ± .0015 (.267 ± .038) 20-PIN CERAMIC SIDE-BRAZED DIP inches (millimeters) Package Type: 20C BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) .017 ±.002 (.432 ±.051) .100 (2.54) .310 ±.010 (7.874 ±.254) .125 (3.175) .050 TYP. (1.270 TYP.) .200 (5.080) 1.000 ±.010 (25.400 ±.254) .010 + .002/-.001 (.254 ±.051/-.025) .300 ± .010 (7.620 ± .254) .085 ±.009 (2.159 ± .229) BSC max min HOLT INTEGRATED CIRCUITS 9 |
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