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HI-3587PQIF Datasheet(PDF) 11 Page - Holt Integrated Circuits |
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HI-3587PQIF Datasheet(HTML) 11 Page - Holt Integrated Circuits |
11 / 11 page HI-3587 PACKAGE DIMENSIONS 44-PIN PLASTIC CHIP-SCALE PACKAGE (QFN) Package Type: 44PCS BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) .203 ± .006 (5.15 ± .15) .016 ± .002 (0.40 ± .05) .010 (0.25) .020 (0.50) .008 (0.2) .039 (1.00) .276 (7.00) BSC .203 ± .006 (5.15 ± .15) typ typ Bottom View Top View BSC .276 (7.00) BSC max inches (millimeters) Heat sink pad on bottom of package. Heat sink must be left floating or connected to V+ DO NOT connect to GND, VDD or V-. Package Type: 0 ° £ Q £ 7° Detail A See Detail A SQ. 44PTQS 44-PIN PLASTIC QUAD FLAT PACK (PQFP) .006 (.15) .547 ± .010 (13.90 ± .25) .394 ± .004 (10.0 ± .10) SQ. MAX. .014 ± ..002 (.35 ± .05) .035 .006 ± (.88 .15) ± .005 (.13) R MIN. .012 (.30) R MAX. .055 .002 ± (1.4 .05) ± .063 (1.6) MAX. .0315 (.80) inches (millimeters) BSC BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) HOLT INTEGRATED CIRCUITS 11 |
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