ADP3611

http://onsemi.com

5

Parameter

Rating

Unit

VCC

−0.3 to +6

V

BST, DRVH

DC

t < 200 ns

−0.3 to +26

−0.3 to +31

V

BST to SW

−0.3 to +6

V

BST to VCC

DC

t < 200 ns

−0.3 to +21

−0.3 to +26

V

SW

DC

t < 200 ns

−1 to +21

−6 to +26

V

DRVH to SW

−0.3 to +6

V

DRVH

SW − 0.3 to BST + 0.3

V

DRVL

DC

t < 200 ns

−0.3 to +6

−5 to +6

V

All Other Inputs and Outputs

−0.3 to +6

V

2−Layer Board

4−Layer Board

340

220

°C/W

143

°C/W

Operating Ambient Temperature Range

−10 to +100

°C

Junction Temperature Range

−10 to +150

°C

Storage Temperature Range

−65 to +150

°C

Lead Temperature Range

Soldering (10 s)

Vapor Phase (60 s)

Infrared (15 s)

300

215

220

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

Pin Configuration

Figure 5. 10−Lead MSOP Package

ADP3611

TOP VIEW

(Not to Scale)

IN

SD

DRVLSD

CROWBAR

VCC

BST

DRVH

SW

GND

DRVL

1

2

3

10

9

8

4

5

6

7

Figure 6. 8−Lead DFN 2 x 2 mm Package

IN

SD

DRVLSD

VCC

BST

DRVH

SW

DRVL

ADP3611

TOP VIEW

(Not to Scale)