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AMIS30532C5321RG Datasheet(PDF) 4 Page - ON Semiconductor |
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AMIS30532C5321RG Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 29 page AMIS--30532 http://onsemi.com 4 EQUIVALENT SCHEMATICS Following figure gives the equivalent schematics of the user relevant inputs and outputs. The diagrams are simplified representations of the circuits used. IN 4K IN 4K TYPE 1: CLR input TYPE 2: CLK , DI, CSB , NXT , DIR inputs . VDD VDD TYPE 3: VDD and VBB power supply inputs VBB VBB OUT TYPE 4: DO and ERRB open drain outputs SLA Rout TYPE 5: SLA analog output Figure 3. In-- and Output Equivalent Diagram PACKAGE THERMAL CHARACTERISTICS The AMIS--30532 is available in a NQFP32 package. For cooling optimizations, the NQFP has an exposed thermal pad which has to be soldered to the PCB ground plane. The ground plane needs thermal vias to conduct the heat to the bottom layer. Figure 3 gives an example for good power distribution solutions. For precise thermal cooling calculations the major thermal resistances of the device are given. The thermal media to which the power of the devices has to be given are: • Static environmental air (via the case) • PCB board copper area (via the exposed pad) The thermal resistances are presented in Table 5: DC Parameters. The major thermal resistances of the device are the Rth from the junction to the ambient (Rthja) and the overall Rth from the junction to exposed pad (Rthjp). In Table 5 below one can find the values for the Rthja and Rthjp, simulated according to JESD--51: The Rthja for 2S2P is simulated conform JEDEC JESD--51 as follows: • A 4--layer printed circuit board with inner power planes and outer (top and bottom) signal layers is used • Board thickness is 1.46 mm (FR4 PCB material) • The 2 signal layers: 70 mm thick copper with an area of 5500 mm2 copper and 20% conductivity • The 2 power internal planes: 36 mm thick copper with an area of 5500 mm2 copper and 90% conductivity The Rthja for 1S0P is simulated conform to JEDEC JESD--51 as follows: • A 1--layer printed circuit board with only 1 layer • Board thickness is 1.46 mm (FR4 PCB material) • The layer has a thickness of 70 mm copper with an area of 5500 mm2 copper and 20% conductivity |
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