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2CW035680YQ2 Datasheet(PDF) 1 Page - Silan Microelectronics Joint-stock |
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2CW035680YQ2 Datasheet(HTML) 1 Page - Silan Microelectronics Joint-stock |
1 / 4 page 2CW035XXXYQ HANGZHOU SILAN MICROELECTRONICS CO.,LTD REV:1.1 2006.03.08 Http: www.silan.com.cn Page 1 of 4 2CW035XXXYQ SERIES ZENER DIODE CHIPS FOR GLASS SEAL DESCRIPTION Ø 2CW035XXXYQ series are low-power zener diode chips for glass seal that fabricated in silicon epitaxial planar technology. Ø The series can provide three kinds of precision voltage chips for different regulator voltage. Ø The chip thickness is 140 µm. The top electrode material is Ag bump, and the back-side electrode material is Ag. Ø Chip size: 0.35 X 0.35 (mm)2. 2CW035XXXYQ CHIP TOPOGRAPHY 2CW035XXXYQ APPEARANCE Parameter Symbol Min. Type Max. Unit Chip Size D 280 -- 320 µm Chip Thickness C 120 -- 160 µm Bump Size A 215 -- 262 µm Bump Height B 25 -- 60 µm Scribe Line Width / -- 40 -- µm ORDERING INFORMATION Series Specification 2CW035XXXYQ-2 2% tolerance 2CW035XXXYQ-5 5% tolerance 2CW035XXXYQ Normal, Approximately 5% tolerance ABSOLUTE MAXIMUM RATINGS Characteristics Symbol Test conditions Value Unit Junction Temperature Tj ---- 175 °C Storage Temperature Tstg ---- -50~+175 °C Chip Appearance Diagram |
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