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2CW032430YQ Datasheet(PDF) 1 Page - Silan Microelectronics Joint-stock |
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2CW032430YQ Datasheet(HTML) 1 Page - Silan Microelectronics Joint-stock |
1 / 7 page 2CW032XXXYQ 2CW032XXXYQ SERIES ZENER DIODE CHIPS FOR GLASS SEAL DESCRIPTION 2CW032XXXYQ series are low-power zener diode chips for glass seal that fabricated in silicon epitaxial planar technology. The series can provide three precision voltage chips for different regulator voltage. The chip thickness is 140 μm. The top electrode material is Ag bump, and the back-side electrode material is Ag. Chip size: 0.32 X 0.32 (mm)2. 2CW032XXXYQ CHIP TOPOGRAPHY 2CW032XXXYQ APPEARANCE Parameter Symbol Min. Type Max. Unit Chip Size D 290 -- 310 μm Chip Thickness C 120 -- 160 μm Bump Size A 196 -- 240 μm Bump Height B 25 -- 55 μm Scribe Line Width / -- 40 -- μm Ordering Specification Series Specification 2CW032XXXYQ-2 2% tolerance 2CW032XXXYQ-5 5% tolerance 2CW032XXXYQ Normal, Approximately 5% tolerance ABSOLUTE MAXIMUM RATINGS Characteristics Symbol Test conditions Value Unit Junction Temperature Tj ---- 175 °C Storage Temperature Tstg ---- -50~+175 °C Chip Appearance Diagram HANGZHOU SILAN MICROELECTRONICS CO.,LTD REV:1.0 2008.02.27 Http: www.silan.com.cn Page 1 of 7 |
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