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NCP5386AMNR2G Datasheet(PDF) 1 Page - ON Semiconductor |
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NCP5386AMNR2G Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 33 page © Semiconductor Components Industries, LLC, 2008 May, 2008 − Rev. 1 1 Publication Order Number: NCP5386/D NCP5386, NCP5386A, NCP5386B 1/2 Phase Controller for CPU and Chipset Applications The NCP5386 is a one− or two−phase buck controller which combines differential voltage and current sensing, and adaptive voltage positioning to power both AMD and Intel processors and chipsets. Dual−edge pulse−width modulation (PWM) combined with inductor current sensing reduces system cost by providing the fastest initial response to transient load events. Dual−edge multi−phase modulation reduces total bulk and ceramic output capacitance required to satisfy transient load−line regulation. A high performance operational error amplifier is provided, which allows easy compensation of the system. The proprietary method of Dynamic Reference Injection (Patented) makes the error amplifier compensation virtually independent of the system response to VID changes, eliminating tradeoffs between overshoot and dynamic VID performance. Features • Meets Intel’s VR 10.0 and 11.0, and AMD Specifications • No load Intel VR Offset of −19 mV (NCP5386), +20 mV (NCP5386A), and 0 mV (NCP5386B) • Dual−Edge PWM for Fastest Initial Response to Transient Loading • High Performance Operational Error Amplifier • Supports both VR11 and Legacy Soft−Start Modes • Dynamic Reference Injection (Patent# 7057381) • DAC Range from 0.5 V to 1.6 V • "0.5% System Voltage Accuracy from 1.0 V to 1.6 V • True Differential Remote Voltage Sensing Amplifier • Phase−to−Phase Current Balancing • “Lossless” Differential Inductor Current Sensing • Differential Current Sense Amplifiers for each Phase • Adaptive Voltage Positioning (AVP) • Frequency Range: 100 kHz – 1.0 MHz • OVP with Resettable, 8 Event Delayed Latch • Threshold Sensitive Enable Pin for VTT Sensing • Power Good Output with Internal Delays • Programmable Soft−Start Time • This is a Pb−Free Device* Applications • Desktop Processors and Chipsets • Server Processors and Chipsets • DDR *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. QFN32, 5 x 5* MN SUFFIX CASE 485AF Device Package Shipping† ORDERING INFORMATION NCP5386MNR2G* QFN32 (Pb−Free) 2500 / Tape & Reel MARKING DIAGRAMS NCP5386 = Specific Device Code x = Blank, A or B A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package http://onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. *Pin 33 is the thermal pad on the bottom of the device. *Temperature Range: 0°C to 85°C 32 1 NCP5386x AWLYYWWG 1 NCP5386AMNR2G* QFN32 (Pb−Free) 2500 / Tape & Reel NCP5386BMNR2G* QFN32 (Pb−Free) 2500 / Tape & Reel |
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