NP−SAMC Series

http://onsemi.com

7

PACKAGE DIMENSIONS

A

S

D

B

J

P

K

C

H

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. D DIMENSION SHALL BE MEASURED WITHIN

DIMENSION P.

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.160

0.180

4.06

4.57

B

0.130

0.150

3.30

3.81

C

0.075

0.095

1.90

2.41

D

0.077

0.083

1.96

2.11

H

0.0020

0.0060

0.051

0.152

J

0.006

0.012

0.15

0.30

K

0.030

0.050

0.76

1.27

P

0.020 REF

0.51 REF

S

0.205

0.220

5.21

5.59

SMB

CASE 403C−01

ISSUE A

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

mm

inches

SCALE 8:1

2.743

0.108

2.159

0.085

2.261

0.089

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