NOTES: UNLESS OTHERWISE SPECIFIED

1. EPOXY COATING

2. 63Sn/37Pb EUTECTIC BUMP

3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.

4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED

COUNTERCLOCKWISE.

5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS

PACKAGE HEIGHT.

6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.

8-Bump micro SMD Package

NS Package Number BPA08EFB

X

X

X

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