LY625128

Rev. 2.2

512K X 8 BIT LOW POWER CMOS SRAM

5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.

TEL: 886-3-6668838

FAX: 886-3-6668836

10

®

PACKAGE OUTLINE DIMENSION

32 pin 450 mil SOP Package Outline Dimension

UNIT

SYM.

INCH.(BASE)

MM(REF)

A

0.118 (MAX)

2.997 (MAX)

A1

0.004(MIN)

0.102(MIN)

A2

0.111(MAX)

2.82(MAX)

b

0.016(TYP)

0.406(TYP)

c

0.008(TYP)

0.203(TYP)

D

0.817(MAX)

20.75(MAX)

E

0.445 ±0.005

11.303 ±0.127

E1

0.555 ±0.012

14.097 ±0.305

e

0.050(TYP)

1.270(TYP)

L

0.0347 ±0.008 0.881 ±0.203

L1

0.055 ±0.008

1.397 ±0.203

S

0.026(MAX)

0.660 (MAX)

y

0.004(MAX)

0.101(MAX)

Θ

0

0