Copyright

© ANPEC Electronics Corp.

Rev. A.1 - Dec., 2008

www.anpec.com.tw

3

APA0715

Symbol

Parameter

Range

Unit

Supply Voltage

2.4

~ 5.5

V

High Level Threshold Voltage

SD

1.8

V

Low Level Threshold Voltage

SD

0

~ 0.35

V

Common Mode Input Voltage

0.5

Operating Ambient Temperature Range

-40

~ 85

Operating Junction Temperature Range

-40

~ 125

Speaker Resistance

3

~

Ω

Symbol

Parameter

Typical Value

Unit

θ

JA

Thermal Resistance -Junction to Ambient

MSOP-8

MSOP-8P

TDFN3x3-8

200

52

54

θ

JC

Thermal Resistance -Junction to Case

MSOP-8P

TDFN3x3-8

10

11

Recommended Operating Conditions

APA0715

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Supply Current

-

1.5

3

mA

Shutdown Current

SD = 0V

-

-

5

µA

Input Current

SD

-

0.1

-

µA

Start-Up Time from End of

Shutdown

µF

-

50

-

ms

Resistance from Shutdown to

GND

90

100

110

k

Ω

C

Ω

-

2.4

-

Ω

-

2.1

-

THD+N = 1%

Ω

1

1.3

-

Ω

-

3

-

Ω

-

2.6

-

Output Power

THD+N = 10%

Ω

-

1.6

-

W

THD+N

Total Harmonic Distortion

Pulse Noise

Ω

-

0.035

-

%

PSRR

Power Supply Rejection Ratio

µF, R

Ω, V

-

75

-

dB

Electrical Characteristics

V

Note 2: Please refer to “ Layout Recommendation”, the Thermal Pad on the bottom of the IC should soldered directly to the PCB’s

ThermalPad area that with several thermal vias connect to the ground plan, and the PCB is a 2-layer, 5-inch square area with

2oz copper thickness.

Note 3: The case temperature is measured at the center of the Thermal Pad on the underside of the MSOP-8P and TDFN3x3-8

package.