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LA73B-1 Datasheet(PDF) 8 Page - LIGITEK electronics co., ltd.

Part No. LA73B-1
Description  LED ARRAY
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Maker  LIGITEK [LIGITEK electronics co., ltd.]
Homepage  http://www.ligitek.com

 8 page
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MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
JIS C 7021: B-11
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
1.T.Sol=260 ℃±5
2.Dwell time= 10 ±1sec.
1.T.Sol=230 ℃±5
2.Dwell time=5 ±1sec
Solderability Test
This test intended to see soldering well
performed or not.
2.RH=90 %~95%
3.t=240hrs ±2hrs
1.Ta=105 ℃±5&-40℃±5
(10min) (10min)
2.total 10 cycles
Solder Resistance
Thermal Shock Test
High Temperature
High Humidity Test
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
The purpose of this test is the resistance
of the device under tropical for hous.
JIS C 7021: B-12
JIS C 7021: B-10
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
1.Under Room Temperature
3.t=1000 hrs (-24hrs, +72hrs)
1.Ta=-40 ℃±5
2.t=1000 hrs (-24hrs, +72hrs)
1.Ta=105 ℃±5
2.t=1000 hrs (-24hrs, +72hrs)
Low Temperature
Storage Test
Operating Life Test
High Temperature
Storage Test
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Test Condition
Test Item
Reliability Test:
Property of Ligitek Only

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