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ISO7420D Datasheet(PDF) 10 Page - Texas Instruments |
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ISO7420D Datasheet(HTML) 10 Page - Texas Instruments |
10 / 19 page 10 100 0 250 500 750 1000 V – WorkingVoltage – V IORM 880 120 V at560V IORM 28 Years G001 ISO7420, ISO7420M ISO7421, ISO7421M SLLS984A – JUNE 2009 – REVISED DECEMBER 2009 www.ti.com REGULATORY INFORMATION VDE CSA UL Certified according to IEC Approved under CSA Component Recognized under 1577 Component Recognition 60747-5-2 Acceptance Notice Program(1) File number: pending (40016131) File number: pending (1698195) File number: pending (E181974) (1) Production tested ≥ 3000 Vrms for 1 second in accordance with UL 1577. LIFE EXPECTANCY vs WORKING VOLTAGE Figure 4. Life Expectancy vs Working Voltage IEC SAFETY LIMITING VALUES Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT θJA = 212°C/W, VI = 5.5 V, TJ = 170°C, TA = 25°C 124 Safety input, output, or supply IS mA current θJA = 212°C/W, VI = 3.6 V, TJ = 170°C, TA = 25°C 190 TS Maximum case temperature 150 °C The safety-limiting constraint is the absolute-maximum junction temperature specified in the Absolute Maximum Ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Characteristics table is that of a device installed in the JESD51-3, Low-Effective-Thermal-Conductivity Test Board for Leaded Surface-Mount Packages and is conservative. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. PACKAGE THERMAL CHARACTERISTICS (over recommended operating conditions unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Low-K thermal resistance(1) 212 θJA Junction-to-air thermal resistance °C/W High-K thermal resistance(1) 122 (1) Tested in accordance with the low-K or high-K thermal metric definitions of EIA/JESD51-3 for leaded surface-mount packages 10 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): ISO7420, ISO7420M ISO7421, ISO7421M |
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