TPS2560

TPS2561

SLVS930 – DECEMBER 2009

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

AVAILABLE OPTIONS AND ORDERING INFORMATION

MARKING

RECOMMENDED MAXIMUM

AMBIENT

ENABLE

CONTINUOUS LOAD CURRENT PER

(DRC)

CHANNEL

TPS2560

Active low

TPS2560DRC

2560

–40°C to 85°C

2.5 A

TPS2561

Active high

TPS2561DRC

2561

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

Maximum ambient temperature is a function of device junction temperature and system level considerations, such as power dissipation

and board layout. See dissipation rating table and recommended operating conditions for specific information related to these devices.

(3)

Add an R suffix to the device type for tape and reel.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted

(1) (2)

VALUE

UNIT

Voltage range on IN, OUTx, ENx or ENx, ILIM, FAULTx

–0.3 to 7

V

Voltage range from IN to OUTx

–7 to 7

V

Continuous output current

Internally Limited

Continuous total power dissipation

See the Dissipation Rating Table

Continuous FAULTx sink current

25

mA

ILIM source current

Internally Limited

mA

HBM

2

kV

ESD

CDM

500

V

8/15

kV

Maximum junction temperature

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Voltages are referenced to GND unless otherwise noted.

(3)

Surges per EN61000-4-2, 1999 applied between USB and output ground of the TPS2560EVM (HPA424) evaluation module

(documentation available on the Web.) These were the test level, no the failure threshold.

(4)

Ambient over temperature shutdown threshold

DISSIPATION RATING TABLE

THERMAL

THERMAL

RESISTANCE

BOARD

PACKAGE

POWER

RATING

DRC

41.6 °C/W

10.7 °C/W

2403 mW

(1)

(2)

The JEDEC high-K (2s2p) board used to derive this data was a 3in × 3in, multilayer board with 1-ounce internal power and ground

planes and 2-ounce copper traces on top and bottom of the board.

2

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Product Folder Link(s): TPS2560 TPS2561