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CS497004-CQZR Datasheet(PDF) 11 Page - Cirrus Logic |
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CS497004-CQZR Datasheet(HTML) 11 Page - Cirrus Logic |
11 / 34 page DS752PP8 Copyright 2009 Cirrus Logic 11 CS4970x4 Data Sheet 32-bit High Definition Audio Decoder DSP Family 5.4 Power Supply Characteristics (Measurements performed under operating conditions.) 5.5 Thermal Data (144-Pin LQFP) 5.6 Thermal Data (128-pin LQFP) Notes: 1.Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz copper covering 20% of the top and bottom layers. 2.Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz copper covering 20% of the top and bottom layers and 0.5-oz copper covering 90% of the internal power plane and ground plane layers. 3.To calculate the die temperature for a given power dissipation Τ j = Ambient Temperature + [ (Power Dissipation in Watts) * θja ] 4.To calculate the case temperature for a given power dissipation Τ c = Τj - [ (Power Dissipation in Watts) * ψ jt ] Input leakage current (all digital pins with internal pull- up resistors enabled, and XTI) IIN-PU -- 70 μA Parameter Min Typ Max Unit Power supply current: Core and I/O operating: VDD1 PLL operating: VDDA With external memory and most ports operating: VDDIO 1.Dependent on application firmware and DSP clock speed. - - - 500 3.5 120 - - - mA mA mA Parameter Symbol Min Typ Max Unit Thermal Resistance (Junction to Ambient) Two-layer Board1 Four-layer Board2 θ ja - - 48 40 - - °C / Watt Thermal Resistance (Junction to Top of Package) Two-layer Board1 Four-layer Board2 ψ jt - - .39 .33 - - °C / Watt Parameter Symbol Min Typ Max Unit Thermal Resistance (Junction to Ambient) Two-layer Board1 Four-layer Board2 θ ja - - 53 44 - - °C / Watt Thermal Resistance (Junction to Top of Package) Two-layer Board1 Four-layer Board2 ψ jt - - .45 .39 - - °C / Watt Parameter Symbol Min Typ Max Unit |
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