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LHR9553-TR1 Datasheet(PDF) 6 Page - LIGITEK electronics co., ltd. |
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LHR9553-TR1 Datasheet(HTML) 6 Page - LIGITEK electronics co., ltd. |
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6 / 8 page  LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/7 245 ±5℃ within 5 sec Soldering heat Soldering heat Max. 260 ℃ Preheat 120 ~ 150 ℃ 120 ~ 180 sec Soldering Iron: Basic spec is ≦5 sec when 260℃. If temperature is higher, time should be shorter(+10 ℃ → -1sec). Power dissipation of iron should be smaller than 15W,and temperature should be controllable. Surface temperature of the device should be under 230 ℃. PART NO. LHR9553/TR1 220 Temp. ( ℃) Reflow Temp/Time 120 150 Preheat Rising +5 ℃/sec Cooling -5 ℃/sec 60 ~ 120 sec 5sec Time |
Similar Part No. - LHR9553-TR1 |
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Similar Description - LHR9553-TR1 |
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