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LSEFG9553-R4-TR1 Datasheet(PDF) 7 Page - LIGITEK electronics co., ltd. |
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LSEFG9553-R4-TR1 Datasheet(HTML) 7 Page - LIGITEK electronics co., ltd. |
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7 / 9 page  Soldering heat Max. 260 ℃ 120 ~ 150 ℃ 120 ~ 180 sec 5sec 60 ~ 120 sec Note: 1.Wave solder and reflow soldering should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Page 6/8 Recommended Soldering Conditions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 245 ±5℃ within 5 sec Preheat 2. Wave Solder 240 3-1. LEAD Reflow Solder Temp. ( ℃) 1. Hand Solder Basic spec is ≦ 280℃ 3 sec one time only. Time 260 ° C MaX. 10sec.Max Above 220 °C 60 sec.Max. 150 120 Preheat 1~5 °C/sec Preheat 180~200 °C 3-2 PB-Free Reflow Solder 1~5 ° C/sec 120 sec.Max. Rising +5 ℃/sec Cooling -5 ℃/sec LSEFG9553/R4/TR1 PART NO. |
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