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B32926E3225M189 Datasheet(PDF) 9 Page - EPCOS |
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B32926E3225M189 Datasheet(HTML) 9 Page - EPCOS |
9 / 17 page 1.3 General notes on soldering Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate- gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical characteristics. For short exposures (as in practical soldering processes) the heat load (and thus the possible effects on a capacitor) will also depend on other factors like: Pre-heating temperature and time Forced cooling immediately after soldering Terminal characteristics: diameter, length, thermal resistance, special configurations (e.g. crimping) Height of capacitor above solder bath Shadowing by neighboring components Additional heating due to heat dissipation by neighboring components Use of solder-resist coatings The overheating associated with some of these factors can usually be reduced by suitable coun- termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced cooling process may possibly have to be included. EPCOS recommends the following conditions: Pre-heating with a maximum temperature of 110 °C Temperature inside the capacitor should not exceed the following limits: MKP/MFP 110 °C MKT 160 °C When SMD components are used together with leaded ones, the leaded film capacitors should not pass into the SMD adhesive curing oven. The leaded components should be assembled af- ter the SMD curing step. Leaded film capacitors are not suitable for reflow soldering. Uncoated capacitors For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea- sures are recommended: pre-heating to not more than 110 °C in the preheater phase rapid cooling after soldering B32923E/F ... B32928E/F Efficient filtering – X2 / 305 V AC Page 9 of 17 Please read Cautions and warnings and Important notes at the end of this document. |
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