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B72500T5200S160 Datasheet(PDF) 7 Page - EPCOS |
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B72500T5200S160 Datasheet(HTML) 7 Page - EPCOS |
7 / 33 page Recommended solder pad layout Single chip 4-fold array Dimensions in mm Case size EIA / mm A B C E 0508 / 1220 4-fold array 0.35 0.90 0.40 0.50 0603 / 1608 Single chip 1.00 1.00 1.00 - 0805 / 2012 Single chip 1.40 1.20 1.00 - 1206 / 3216 Single chip 1.80 1.20 2.10 - Delivery mode EIA case size Taping Reel size mm Packing unit pcs. Type Ordering code 4-fold array 0508 Cardboard 180 4000 CA05P4S17TCCG B72714A5170S160 Single chip 0603 Cardboard 180 4000 CT0603K17CCG B72500T5170K060 0603 Cardboard 180 4000 CT0603S20ACCG B72500T5200S160 0805 Blister 180 3000 CT0805K25CCG B72510T5250K062 0805 Blister 330 12000 CT0805S20ACC2G2 B72510T9200S172 1206 Blister 180 3000 CT1206M4CCG B72520T5040M062 Multilayer varistors (MLVs) Controlled capacitance series Page 7 of 33 Please read Cautions and warnings and Important notes at the end of this document. |
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