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SCCT3F150D1B Datasheet(PDF) 3 Page - SAMWHA ELECTRIC |
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SCCT3F150D1B Datasheet(HTML) 3 Page - SAMWHA ELECTRIC |
3 / 3 page SAMWHA CAPACITOR Co., Ltd. 138 Ceramic Type Appendix SMD Type Packing 140 CHIP B/I Packing 142 SMDC Packing 144 Mechanical test and Environmental Substance No. Item Requirement Test Conditions Adhesive Strength of Terminal 1 Solder the capacitor to the testing jig (glass epoxy board) shown in Fig. 2 using a eutectic solder. Then apply 5 N force in the direction of the arrow. The soldering should be used the reflow method and should be conducted with care so that the soldering is uniform and free of defects such as heat shock. No removal of the termination or other defect should occur. SCC Type SCK, SCG, SSC, SSD Type Vibration Resistance Appearance Capacitance Change More than 1000MΩ 2 The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, should be traversed in approximately 1 min. This motion should be applied for a period of 2hrs. in each 3mutually perpendicular directions (total of 6hrs.) No. visible damage ±5% or ±0.5 pF B : With ± 10% Whichever is larger E : With ± 20% from initial measurement F : With ± 30% Dissipation Factor (tan δ,Q) I.R Q ≥ 200 B,E : 5% Max. F : 7.5% Max. Fig.2 Fig.4 Bending Strength Appearance Capacitance Change 3 Solder the capacitor to the testing jig (glass epoxy board) shown in Fig. 3 using a eutectic solder. Then apply a force in the direction shown in Fig. 4. The soldering should be done either with an iron or using the reflow method and should be conducted with care so that the soldering is uniform and free of defects such as heat shock. No. visible damage ±5% or ±0.5 pF B : With ± 10% Whichever is larger E : With ± 20% from initial measurement F : With ± 30% Solder Heat Resistance Appearance Capacitance Change Dielectric Strength 5 No. visible damage ±5% or ±0.5 pF B : With ± 5% Whichever is larger E : With ± 15% from initial measurement F : With ± 20% No. Failure Fig.3 Solderability Test 4 The regulation of environmental pollution materials. 6 Soldering Method : Reflow Soldering - Maximum Temperature : 250℃ max. (245± 5℃, 5± 0.5 sec.) - Preheating Temperature : 150~180℃, 60~180 sec. Soldering Method : Reflow Soldering - Maximum Temperature : 250℃ max. (245± 5℃, 5± 0.5 sec.) - Preheating Temperature : 150~180℃, 60~180 sec. - After testing, The capacitors shall be subjected to the standard test condition for a period 24 hours and shall be measured. Visual examination terminals area shall be at least 90% covered with a new solder coating ※ Never use materials mentioned below in high voltage products regulated this document. ※ Pb, Hg, Cr+6, PBB, PBDE : 100ppm, Cd : 5ppm ※ Exception : - Pb of solder : <1000ppm - Pb of ceramic(dielectric) |
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