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EQD020A0F Datasheet(PDF) 11 Page - Lineage Power Corporation |
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EQD020A0F Datasheet(HTML) 11 Page - Lineage Power Corporation |
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11 / 15 page  Data Sheet November 9, 2006 EQD020 Series Single Output: Eighth Brick Power Modules: 19-60Vdc Input; 3.3Vdc Output; 66W Tyco Electronics Power Systems 11 Thermal Considerations Power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data is based on physical measurements taken in a wind tunnel. The test set-up is shown in Figure 22. The thermal reference point, Tref, used in the specifications is shown in Figure 23. For reliable operation, this temperature should not exceed the value specified in the Feature Specifications Table. Figure 23. Tref Temperature Measurement Location. Through-Hole Lead-Free Soldering Information The RoHS-compliant through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3 °C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210 °C. For Pb solder, the recommended pot temperature is 260 °C, while the Pb-free solder pot is 270 °C max. Not all RoHS-compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your Tyco Electronics Power System representative for more details. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Tyco Electronics Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). Air flow x Power Module Wind Tunnel PWBs 6.55_ (0.258) 76.2_ (3.0) Probe Location for measuring airflow and ambient temperature 25.4_ (1.0) Figure 22. Thermal Test Set up. Tref |
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