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MS3261R10ML Datasheet(PDF) 1 Page - ABC Taiwan Electronics Corp

Part # MS3261R10ML
Description  MULTILAYER CHIP INDUCTOR
Download  6 Pages
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Manufacturer  ABC [ABC Taiwan Electronics Corp]
Direct Link  http://www.atec-group.com
Logo ABC - ABC Taiwan Electronics Corp

MS3261R10ML Datasheet(HTML) 1 Page - ABC Taiwan Electronics Corp

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ABC'S ITEM NO.
ABC'S DWG NO.
SPECIFICATION FOR APPROVAL
Temperatu re
+4.0
/ sec max.
℃
Rising Area
Max time above 230℃ ：5 0sec max.
Max time above 200℃ ：7 0sec max.
Peak Temp：260℃ max.
d﹒Remark：Products comply with RoHS' requirements
AR-001A
Type
F ( kgf )
time ( sec )
b﹒Operating temp.：-55℃ ---- +125℃
a﹒Storage temp.：-40℃---- +105℃
Ⅳ﹒GENERAL SPECIFICATION：
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
Solder : Sn96.5 / Ag3 / Cu0.5
MS3261
1.0
d﹒Solderability：
c﹒Terminal storength：
250
30±5
or equivalent
100
0
50
150
200
F
NAME
PROD.
REF :
b﹒Internal conductor：Silver or Ag / Pd
Ⅱ﹒SCHEMATIC DIAGRAM：
a﹒Body：Ferrite
Ⅲ﹒MATERIALS：
c﹒Terminal：Cu/Sn
Series
MS3261
A
3.20±0.20
B
1.60±0.20
C
1.10±0.20
B
A
D
Ⅰ﹒CONFIGURATION & DIMENSIONS：
MULTILAYER CHIP INDUCTOR
D
+2.0 ~ 4.0℃
/ sec max.
Reflow Area
70sec max.
100
50
Time ( seco nd s )
150
Preheat Area
150 ~ 200
/ 60 ~ 120sec
℃
260℃
200
250
50sec max.
230℃
-(1 .0 ~ 5.0)
/ sec max.
℃
P eak Temperature:
Forced Coo ling Area
I
G
I
( PCB Pattern )
a
D
0.60±0.40
G
2.2
c
b
Unit : m/m
I
H
1.4
1.1
MS3261□□□□L□-□□□
PAGE: 1


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