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SF2012900YL Datasheet(PDF) 6 Page - ABC Taiwan Electronics Corp |
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SF2012900YL Datasheet(HTML) 6 Page - ABC Taiwan Electronics Corp |
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6 / 7 page  AR-001A SPECIFICATION FOR APPROVAL PROD. NAME Ⅸ﹒RELIABILITY TEST： REF : 20090324-B ABC'S ITEM NO. ABC'S DWG NO. PAGE: 6 SMD LINE FILTER SF2012□□□□L□-□□□ 1-1.Environmental Performance No Item Specification 1-1-1 Temperature Cycle Appearance: No Damage One cycle: Impedance: within±20% of Step Temperature (℃) Time (min) initial value 1 -25±3 30 2 25±23 3 85±3 30 4 25±23 Total: 5 cycles Measured After Exposure in The Room Condition For 1hrs 1-1-2 Humidity Resistance Temperature: 40±2℃ Relative Humidity: 90 ~ 95% Time: 100hrs Measured After Exposure In The Room Condition For 1hrs 1-1-3 High Temperature Resistance Temperature: 85±3℃ Time: 50Hrs Measured After Exposure In The Room Condition For 1Hrs 1-1-4 Low Temperature Resistance Temperature: -25±3℃ Time: 50Hrs Measured After Exposure In The Room Condition For 1Hrs 1-1-5 High Temperature Load Life There should be no evidence Temperature: 85±3℃ of short or open circle Load: Allowed DC Current Time: 500Hrs 1-1-6 Humidity Load Life Temperature: 40±2℃ Relative Humidity: 90~95% Load: Allowed DC Current Time: 500Hrs 1-2.Mechanical Performance No Item Specification 1-2-1 Resistance To Soldering Heat Appearance: No Damage 1. The Device Should Be Reflow soldered on PCB (peak 260℃±5℃ For 10 Seconds) 2. Solder Composition: Sn/Ag3.0/Cu0.5 3. Test Time: 6 minutes 1-2-2 Solder ability The Electrodes Shall Be 1. Pre-Heating: 150℃,1min. At Least 90% Covered 2. Solder Composition: Sn/Ag3.0/Cu0.5 with New Solder Coating 3. Solder Temperature: 245±5℃. 4. Immersion Time: 4±1 sec. 1-2-3 Commponent Adhesion 2 Lbs The device should be reflow soldered (230±5 ℃ For (Push Test) 10 seconds) to a tinned copper substrate. A force guauge should be applied to the side of the component. The device must withstand a minimum force of 2 pounds without a failure of the termination attached to component Test Method Test Method |
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