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MAX4163EUA+ Datasheet(PDF) 11 Page - Maxim Integrated Products |
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MAX4163EUA+ Datasheet(HTML) 11 Page - Maxim Integrated Products |
11 / 13 page UCSP, Micropower, Single-Supply, 10V, Rail-to-Rail I/O Op Amps ______________________________________________________________________________________ 11 1) The on-board charge pumps generate a small amount of 700kHz switching noise at the op amp’s output. The amplitude of this noise is typically 100µVP-P. The noise is not referred to the input, and is independent of amplifier gain. The charge-pump switching frequency is well beyond the amplifier’s 200kHz bandwidth, and is therefore unnoticeable in most applications. 2) The charge pumps typically require up to 20µs on power-up to fully energize the internal supply rails (Figure 3). Power Supplies and Layout The MAX4162/MAX4163/MAX4164 are guaranteed to operate from a single 2.5V to 10.0V power supply, but full rail-to-rail operation typically extends below 2V. For single-supply operation, bypass the power supply with a 1µF capacitor in parallel with a 0.1µF ceramic capacitor. If operating from dual supplies, bypass each supply to ground. Good layout improves performance by decreasing the amount of stray capacitance at the op amp’s inputs and output. To decrease stray capacitance, minimize both trace and external component lead lengths, and place external components close to the op amp’s pins. UCSP Package Consideration For general UCSP package information and PC layout considerations, please refer to the Maxim Application Note (Wafer-Level Ultra-Chip-Board-Scale-Package). UCSP Reliability The UCSP represents a unique packaging form factor that may not perform equally to a packaged product through traditional mechanical reliability tests. UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and usage environ- ment. The user should closely review these areas when considering use of a UCSP. Performance through oper- ating life test and moisture resistance remains uncom- promised as it is primarily determined by the wafer-fabrication process. Mechanical stress perfor- mance is a greater consideration for a UCSP package. UCSPs are attached through direct solder contact to the user’s PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder joint contact integrity must be considered. Table 1 shows the testing done to characterize the UCSP reliability performance. In conclusion, the UCSP is capable of performing reliably through environmental stresses as indicated by the results in the table. Additional usage data and recommendations are detailed in the UCSP application note, which can be found on Maxim’s website at www.maxim-ic.com. TEST CONDITIONS DURATION NO. OF FAILURES PER SAMPLE SIZE Temperature Cycle -35°C to +85°C, -40°C to +100°C 150 cycles, 900 cycles 0/10, 0/200 Operating Life TA = +70°C 240h 0/10 Moisture Resistance -20°C to +60°C, 90% RH 240h 0/10 Low-Temperature Storage -20°C 240h 0/10 Low-Temperature Operational -10°C 24h 0/10 Solderability 8h steam age — 0/15 ESD ±2000V, Human Body Model — 0/5 High-Temperature Operating Life TJ = +150°C 168h 0/45 Table 1. Reliability Test Data |
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