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US1050CP Datasheet(PDF) 5 Page - UNISEM |
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US1050CP Datasheet(HTML) 5 Page - UNISEM |
5 / 7 page US1050 2-37 Rev. 1.3 10/27/00 V V V V I A T C IN O OUT A MAX = = = = ° 5 3 5 4 6 35 . . ( ) ( ) P I V V P . . . W D O UT IN O UT D = × − = × − = 4 6 5 3 5 6 9 θJC C W = ° 2 7 . / ( ) ( ) T T P . . . S J D = − × + = − × + = ° θ θ JC CS S T C 135 6 9 2 7 0 05 116 ∆T S A T T C = − = − = ° 116 35 81 Thermal Design The US1050 incorporates an internal thermal shutdown that protects the device when the junction temperature exceeds the maximum allowable junction temperature. Although this device can operate with junction tempera- tures in the range of 150 °C ,it is recommended that the selected heat sink be chosen such that during maxi- mum continuous load operation the junction tempera- ture is kept below this number. The example below shows the steps in selecting the proper Regulator heat sink for the worst case current consumption using Intel 200MHz microprocessor as the load . Assuming the following specifications : The steps for selecting a proper heat sink to keep the junction temperature below 135 °C is given as : 1) Calculate the maximum power dissipation using : 2) Select a package from the Regulator data sheet and record its junction to case (or Tab) thermal resistance. Selecting TO220 package gives us : 3) Assuming that the heat sink is Black Anodized, cal- culate the maximum Heat sink temperature allowed : Assume , θcs=0.05°C/W (Heat sink to Case thermal resistance for Black Anodized) 4) With the maximum heat sink temperature calcu- lated in the previous step, the Heat Sink to Air thermal resistance ( θsa) is calculated by first calculating the temperature rise above the ambient as follows : ∆T=Temperature Rise Above Ambient 5) Next , a heat sink with lower θsa than the one calcu- lated in step 4 must be selected. One way to do this is to simply look at the graphs of the “Heat Sink Temp Rise Above the Ambient” vs. the “Power Dissipation” and select a heat sink that results in lower temperature rise than the one calculated in previous step. The following heat sinks from AAVID and Thermaloy meet this crite- ria. Air Flow (LFM) 0 100 200 300 400 Thermalloy 6021PB 6021PB 6073PB 6109PB 7141D AAVID 534202B 534202B 507302 575002 576802B Note : For further information regarding the above com- panies and their latest product offerings and application support contact your local representative or the num- bers listed below: AAVID PH# (603) 528 3400 Thermalloy PH# (214) 243-4321 Designing for Microprocessor Applications As it was mentioned before the US1050 is designed spe- cifically to provide power for the new generation of the low voltage processors requiring voltages in the range of 2.5V to 3.6V generated by stepping down the 5V supply. These processors demand a fast regulator that supports their large load current changes. The worst case current step seen by the regulator is anywhere in the range of 1 to 7A with the slew rate of 300 to 500 nS which could happen when the processor transitions from “Stop Clock” mode to the “Full Active” mode. The load current step at the processor is actually much faster ,in the order of 15 to 20 nS,however the decoupling capaci- tors placed in the cavity of the processor socket handle this transition until the regulator responds to the load current levels. Because of this requirement the selec- tion of high frequency low ESR and low ESL output ca- pacitor is imperative in the design of these regulator cir- cuits. Figure 4 shows the effects of a fast transient on the θ θ SA T D SA P C W = = = ° ∆ 81 6 9 117 . . / |
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