CYStech Electronics Corp.

Spec. No. : C654J3

Issued Date : 2004.03.18

Revised Date :2009.02.04

Page No. : 6/6

BTD2195J3

CYStek Product Specification

O-252 Dimension

l

che

met

che

met

T

*: Typica

ers

In

s

Milli

ers

In

s

Milli

DIM

DIM

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Max.

A

0.0177

0.0217

0.45

0.55

G

0.0866

2

0.1102

.20

2.80

B

0.0650

0.0768

1.65

1.95

H

-

*0.0906

-

*2.30

C

0.0354

0.0591

0.90

1.50

I

-

0.0449

-

1.14

D

0.0177

0.0236

0.45

0.60

J

-

0.0346

-

0.88

E

0.2441

0.2677

6.20

6.80

K

0.2047

0.2165

5.20

5.50

F

0.2125

0.2283

5.40

5.80

L

0.0551

0.0630

1.40

1.60

Notes:

aximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

there is any question with packing specification or packing method, please contact your local CYStek sales office.

• Lead : KFC; pure tin plated

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

1.Controlling dimension: millimeters.

2.M

3.If

Material:

• YStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• YStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

C

C

Marking:

B

A

C

E

H

I

J

K

3

2

1

D

F

G

L

Style: Pin 1.Base 2.Collector 3.Emitter

3-Lead TO-252 Plastic Surface Mount Package

CYStek Package Code: J3

D2195