CYStech Electronics Corp.

Spec. No. : C548F5

Issued Date : 2007.12.11

Revised Date :

Page No. : 11/12

LM2596-XXE5/F5

CYStek Product Specification

TO-263-5L Dimension

Inches

Millimeters

Inches

Marking:

LM2596

□□□

□□□□

Date Code

3.3V→-33

Vout:

5.0V→-50

12V→-12

ADJ→

blank

Style: Pin 1.Vin 2.Vout 3.GND

4.Feedback 5.ON/OFF

5-Lead TO-263-5L Plastic Package

CYStek Package Code: F5

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.173

0.189

4.40

4.80

c2

0.049

0.057

1.25

1.45

b

0.026

0.036

0.66

0.91

L2

0.050 REF

1.27 REF

L4

0.000

0.012

0.00

0.30

D

0.339

0.354

8.60

9.00

c

0.014

0.020

0.36

0.50

e

0.067 REF

1.70 REF

L1

0.090

0.110

2.29

2.79

L

0.575

0.622

14.6

15.8

E

0.386

0.409

9.80

10.4

θ

0°

8°

0°

8°

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

Recommended wave soldering condition

Product

Peak Temperature

Soldering Time

Pb-free devices

260 +0/-5

°C

5 +1/-1 seconds