DATA SHEET • CLA SERIES DIODES

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

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September 28, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200100I

Package Outline Drawings

Package outline die drawings for the CLA diode series are shown

in Figures 12, 13, and 14. Hermetic package outlines are shown

in Figures 15 through 18.

Die Packages

0.014 ± 0.001

(0.325 ± 0.025 mm)

0.014 ± 0.001

(0.325 ± 0.025 mm)

Cathode Metallized Back

Contact, Gold

Anode

Top Contact, Gold

0.002 (0.050 mm)

Dia. Min.

0.004 (0.010 mm)

0.006 (0.015 mm) Nom.

Schematic

S1565

1

2

1

2

Figure 12. 149-815 Package

Anode

Metallized

Gold Dot

Silicon

Cathode Metallized Back

Contact: Gold

0.004 (0.127 mm) Min.

0.006 (0.152 mm) Max.

0.010 (0.251 mm) Min.

0.014 (0.356 mm) Max. Sq.

150-801:

0.002 (0.051 mm) Min.

S1567

Schematic

1

2

1

2

150-806:

0.0011 (0.028 mm) Nom.

Figure 13. 150 Series Package