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TPS2505B1RGWR Datasheet(PDF) 8 Page - Texas Instruments |
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TPS2505B1RGWR Datasheet(HTML) 8 Page - Texas Instruments |
8 / 28 page TPS2505 SPAS093A – DECEMBER 2009 – REVISED FEBRUARY 2010 www.ti.com FAULT1/2 FAULT1/2 are open-drain outputs that indicate when the USB switches are in an overcurrent or over-temperature condition. FAULT1/2 have a fixed internal deglitch of tDEG to prevent false triggering from noise or transient conditions. FAULT1/2 assert low if the USB switches remain in an overcurrent condition for longer than tDEG. FAULT1/2 de-assert when the overcurrent condition is removed after waiting for the same tDEG period. Over-temperature conditions bypass the internal delay period and assert/de-assert the FAULT1/2 output immediately upon entering or leaving an over-temperature condition. FAULT1/2 are asserted low when VAUX falls below VTRIP (4.6 V, typical). ENUSB1/2 ENUSB1/2 are logic-level inputs that enable the USB switches. Pull ENUSB1/2 above 1 V to enable the USB switches and below 0.7 V to disable the USB switches. ENUSB1/2 only enables the USB switches. The boost converter is independent of ENUSB1/2 and continues to operate even when ENUSB disables the USB switch. USB1/2 USB1/2 are the outputs of the USB switches and should be connected to the USB connectors to provide USB power. Although the device does not require it for operation, a bulk capacitor may be connected from USB to PGND to meet USB standard requirements. See the latest USB 2.0 specification for further details. AUX AUX is the boost converter output and provides power to the USB switches and to any additional load connected to AUX. Internal feedback regulates AUX to 5.1 V. Connect a 22-µF ceramic capacitor from AUX to PGND to filter the boost converter output. See COMPONENT RECOMMENDATIONS for further details. Additional external load can be connected to AUX as long as the total current drawn by the USB switches and external load does not overload the boost converter. See Determining the Maximum Allowable AUX and USB1/2 Current for details. SW SW is the internal boost converter connection of the low-side N-channel MOSFET drain and the high-side P-channel drain. Connect the boost inductor from IN to SW close to the device to minimize parasitic effects on the device operation. THERMAL PAD The thermal pad connection is used to heat-sink the device to the printed-circuit board (PCB). The thermal pad may not be connected externally to a potential other than ground because it is connected to GND internally. The thermal pad must be soldered to the PCB to remove sufficient thermal energy in order to stay within the recommended operating range of the device. 8 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): TPS2505 |
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