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DSU2220C104JN Datasheet(PDF) 5 Page - Dubilier |
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DSU2220C104JN Datasheet(HTML) 5 Page - Dubilier |
5 / 6 page Fax: 01371 875075 www.dubilier.co.uk Tel: 01371 875758 17 SURFACE MOUNT CERAMIC SURFACE MOUNT MULTI - LAYER DS PERFORMANCE CHARACTERISTICS PERFROMANCE CHARACTERISTICS 1. ELECTRICAL Dielectric Code COG X7R X5R Y5V Z5U General COG dielectrics are very stable. Temperature, fre- quency and time vary little. X7R dielectrics offer higher capacitance for a given case size than COG. X5R dielectrics offer higher capacitance for a given case size than X7R. Y5V dielectrics offer the highest capacitance for a given case size than X5R. Z5U dielectrics offer the highest cpacitance for a given case size than Y5V. Examples of Applications Typical applications are in tuned circuits, timing circuits and fast rise time circuits. Applications would include bypass, coupling and filter- ing circuits. Applictaions would include bypass, coupling and filter- ing circuits. Applications would include bypass and decoupling circuits or where tempera- ture dependence is not of major importance. Applications would include bypass and decoupling circuits or where tempera- ture dependance is not of major importance. Temperature Range - 55° to + 125° -55° to + 125° - 55° to + 85° - 25° to + 85° - 25° to + 85° Insulation Resistance (I.R.) after 1 min charging at Rated Voltage > 100G ohms or 1000 sec whichever is less >100G ohms or 1000 sec whichever is less >100G ohms or 1000sec whichever is less. >10G ohms or 100 sec whichever is less. >10G ohms or 100 sec whichever is less. Voltage Ratings dc 50, 100, 200, 500 10, 16, 25, 50, 100, 200, 500 10,16,25,50 10, 16, 25, 50, 100 25, 50 Proof Voltage 2.5 x rated voltage 2.5 x rated voltage 2.5 X rated voltage. 2 x rated voltage 2.5 x rated voltage Max allowable Capaci- tance Variation over Temperature Range C > 20pf : 0 ± 00ppm/°C C < 20pF : see CECC 32 101-801 ± 15% ± 15% +30% to - 80% +22% to - 56% . ENVIRONMENT Test Conditions Requirement Resistance to soldering heat Components completely immersed in a solder bath at 260 ± 10° for 5 secs. 25% Max leaching on each edge Adhesion Component mounted to substrate a force of 5N applied normal to the line joining the termination and in a line parallel to the substrate. No visible damage Rapid change or Tem- perature - 55 to 125°C, 5 cycles (1B, 2C1) - 25 to +85°, 5 cycles (2F4) No visible damage. After recovery ∆ C/C ≤±1% or pF COG ∆ C/C ≤±10% X7R ∆ C/C ≤±10% X5R ∆ C/C ≤±20% Y5V Tan ≤1.5 x speci- fied value IR. ≤0.25 x speci- fied value |
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