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HYMD216M646C6-D43 Datasheet(PDF) 9 Page - Hynix Semiconductor

Part # HYMD216M646C6-D43
Description  Unbuffered DDR SO-DIMM
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Manufacturer  HYNIX [Hynix Semiconductor]
Direct Link  http://www.skhynix.com/kor/main.do
Logo HYNIX - Hynix Semiconductor

HYMD216M646C6-D43 Datasheet(HTML) 9 Page - Hynix Semiconductor

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HYMD216M646C(L)6-D43/D4/J
Rev. 0.1 / Apr. 2003
9
DC CHARACTERISTICS II (TA=0 to 70oC, Voltage referenced to VSS = 0V)
Parameter
Symbol
Test Condition
Speed
Unit Note
-D43
-D4
-J
Operating Current
IDD0
One bank; Active - Precharge;
tRC=tRC(min); tCK=tCK(min); DQ,DM and
DQS inputs changing twice per clock cycle;
address and control inputs changing once
per clock cycle
TBD
TBD
420
mA
Operating Current
IDD1
One bank; Active - Read - Precharge; Burst
Length=2; tRC=tRC(min); tCK=tCK(min);
address and control inputs changing once
per clock cycle
TBD
TBD
600
mA
Precharge Power Down
Standby Current
IDD2P
All banks idle; Power down mode; CKE=Low,
tCK=tCK(min)
TBD
TBD
80
mA
Idle Standby Current
IDD2F
/CS=High, All banks idle; tCK=tCK(min);
CKE= High; address and control inputs
changing once per clock cycle. VIN=VREF
for DQ, DQS and DM
TBD
TBD
200
mA
Active Power Down
Standby Current
IDD3P
One bank active ; Power down mode;
CKE=Low, tCK=tCK(min)
TBD
TBD
100
mA
Idle Quiet Standby
Current
IDD2Q
/CS>=Vih(min); All banks idle;
CKE>=Vih(min); Addresses and other
control inputs stable, Vin=Vref for DQ, DQS
and DM
TBD
TBD
TBD
mA
Active Standby Current
IDD3N
/CS=HIGH; CKE=HIGH; One bank; Active-
Precharge; tRC=tRAS(max); tCK=tCK(min);
DQ, DM and DQS inputs changing twice per
clock cycle; Address and other control inputs
changing once per clock cycle
TBD
TBD
240
mA
Operating Current
IDD4R
Burst=2; Reads; Continuous burst; One bank
active; Address and control inputs changing
once per clock cycle; tCK=tCK(min);
IOUT=0mA
TBD
TBD
1160
mA
Operating Current
IDD4W
Burst=2; Writes; Continuous burst; One bank
active; Address and control inputs changing
once per clock cycle; tCK=tCK(min); DQ, DM
and DQS inputs changing twice per clock
cycle
TBD
TBD
1160
Auto Refresh Current
IDD5
tRC=tRFC(min) - 8*tCK for DDR200 at
100Mhz, 10*tCK for DDR266A & DDR266B
at 133Mhz; distributed refresh
TBD
TBD
920
Self Refresh Current
IDD6
CKE=<0.2V; External clock on;
tCK =tCK(min)
Normal
TBD
TBD
12
mA
Low Power
TBD
TBD
6
mA
Operating Current -
Four Bank Operation
IDD7
Four bank interleaving with BL=4 Refer to
the following page for detailed test condition
TBD
TBD
1340
mA
Random Read Current
IDD7A
4banks active read with activate every 20ns,
AP(Auto Precharge) read every 20ns, BL=4,
tRCD=3, IOUT=0 mA, 100% DQ, DM and
DQS inputs changing twice per clock cycle;
100% addresses changing once per clock
cycle
TBD
TBD
TBD
mA


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