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HYMD232M726A8-L Datasheet(PDF) 7 Page - Hynix Semiconductor

Part # HYMD232M726A8-L
Description  Unbuffered DDR SO-DIMM
Download  17 Pages
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Manufacturer  HYNIX [Hynix Semiconductor]
Direct Link  http://www.skhynix.com/kor/main.do
Logo HYNIX - Hynix Semiconductor

HYMD232M726A8-L Datasheet(HTML) 7 Page - Hynix Semiconductor

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HYMD232M726A(L)8-J/M/K/H/L
Rev. 0.2/Oct. 02
7
DC CHARACTERISTICS II (TA=0 to 70oC, Voltage referenced to VSS = 0V)
Parameter
Symbol
Test Condition
Speed
Unit Note
-J
-M
-K
-H
-L
Operating Current
IDD0
One bank; Active - Precharge;
tRC=tRC(min); tCK=tCK(min); DQ,DM and
DQS inputs changing twice per clock cycle ;
address and control inputs changing once per
clock cycle
945
945
855
855
810
mA
1
Operating Current
IDD1
One bank; Active - Read - Precharge; Burst
Length=2; tRC=tRC(min); tCK=tCK(min);
address and control inputs changing once per
clock cycle
1350
1350
1170
1170
1080
mA
1
Precharge Power
Down Standby
Current
IDD2P
All banks idle; Power down - mode;
CKE=Low, tCK=tCK(min)
180
mA
1
Idle Standby Current
IDD2F
/CS=High, All banks idle; tCK=tCK(min);
CKE= High; address and control inputs
changing once per clock cycle. VIN=VREF
for DQ, DQS and DM
450
450
360
360
315
mA
1
Active Power Down
Standby Current
IDD3P
One bank active; Power down mode;
CKE=Low, tCK=tCK(min)
225
mA
1
Idle Quiet Standby
Current
IDD2Q
/CS>=Vih(min); All banks idle;
CKE>=Vih(min); Addresses and other control
inputs stable, Vin=Vref for DQ, DQS and DM
TBD
mA
Active Standby
Current
IDD3N
/CS=HIGH; CKE=HIGH; One bank; Active-
Precharge; tRC=tRAS(max); tCK=tCK(min);
DQ, DM and DQS inputs changing twice per
clock cycle; Address and other control inputs
changing once per clock cycle
540
540
450
450
450
mA
1
Operating Current
IDD4R
Burst=2; Reads; Continuous burst; One bank
active; Address and control inputs changing
once per clock cycle; tCK=tCK(min);
IOUT=0mA
2610
2610
2250
2250
1710
mA
1
Operating Current
IDD4W
Burst=2; Writes; Continuous burst; One bank
active; Address and control inputs changing
once per clock cycle; tCK=tCK(min); DQ, DM
and DQS inputs changing twice per clock
cycle
2610
2610
2250
2250
1710
1
Auto Refresh Current
IDD5
tRC=tRFC(min) - 8*tCK for DDR200 at
100Mhz, 10*tCK for DDR266A & DDR266B
at 133Mhz; distributed refresh
2070
2070
1890
1890
1755
1
Self Refresh Current
IDD6
CKE=<0.2V; External clock on;
tCK =tCK(min)
Normal
27
mA
1
Low Power
13.5
mA
1
Operating Current -
Four Bank Operation
IDD7
Four bank interleaving with BL=4 Refer to the
following page for detailed test condition
2835
2835
2745
2745
2520
mA
1
Random Read
Current
IDD7A
4banks active read with activate every 20ns,
AP(Auto Precharge) read every 20ns, BL=4,
tRCD=3, IOUT=0 mA, 100% DQ, DM and
DQS inputs changing twice per clock cycle;
100% addresses changing once per clock
cycle
TBD
mA


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