MICROWAVE CORPORATION

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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Visit us at www.hittite.com, or Email at sales@hittite.com

1

v02.1201

The circuit board used in the final application should use RF circuit design techniques. Signal lines should have 50

ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane

similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes.

The evaluation circuit board shown is available from Hittite upon request.

Recommended PCB Layout for HMC278MS8G

Evaluation Circuit Board Layout Design Details

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HMC278MS8G

100 mW MEDIUM POWER GaAs

MMIC AMPLIFIER, 1.7 - 3.0 GHz