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H5MS5122DFR Datasheet(PDF) 6 Page - Hynix Semiconductor |
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H5MS5122DFR Datasheet(HTML) 6 Page - Hynix Semiconductor |
6 / 62 page Rev 1.2 / Jul. 2008 6 11 Mobile DDR SDRAM 512Mbit (16M x 32bit) H5MS5122DFR Series / H5MS5132DFR Series INFORMATION for Hynix KNOWN GOOD DIE With the advent of Multi-Chip package (MCP), Package on Package (PoP) and System in a Package (SiP) applications, customer demand for Known Good Die (KGD) has increased. Requirements for smaller form factors and higher memory densities are fueling the need for Wafer-level memory solu- tions due to their superior flexibility. Hynix Known Good Die (KGD) products can be used in packaging technologies such as systems-in-a-package (SIP) and multi-chip package (MCP) to reduce the board area required, making them ideal for hand-held PCs, and many other portable digital applications. Hynix Mobile SDRAM will be able to continue its constant effort of enabling the advanced package products of all appli- cation customers. - Please Contact Hynix Office for Hynix KGD product availability and informations. |
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