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H55S2562JFR-A3M Datasheet(PDF) 4 Page - Hynix Semiconductor |
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H55S2562JFR-A3M Datasheet(HTML) 4 Page - Hynix Semiconductor |
4 / 52 page Rev 1.1 / July. 2009 4 11 256Mbit (16Mx16bit) Mobile SDR H55S2562JFR Series INFORMATION for Hynix KNOWN GOOD DIE With the advent of Multi-Chip package (MCPs), Package on Package (PoP) and system in a package (SiP) applications, customer demand for Known Good Die (KGD) has increased. Requirements for smaller form factors and higher memory densities are fueling the need for Wafer-level memory solu- tions due to their superior flexibility. Hynix Known Good Die (KGD) products can be used in packaging technologies such as systems-in-a-package (SIPs) and multi-chip packages (MCPs) to reduce the board area required, making them ideal for hand-held PCs, and many other portable digital applications. Hynix Mobile DRAM will be able to continue its constant effort of enabling the Advanced package products of all appli- cation customers. - Please Contact Hynix Office for Hynix KGD product availability and informations. |
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