2 ______________________________________________________________________________________

6-Channel, Flash-Configurable System Manager

with Nonvolatile Fault Registers

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

MON_, SCL, SDA, A0 to GND ................................-0.3V to +6V

EN, TCK, TMS, TDI to GND ....................................-0.3V to +4V

EN_OUT1, EN_OUT2, EN_OUT3

(configured as open-drain) to GND ..................-0.3V to +15V

EN_OUT1, EN_OUT2, EN_OUT3

(configured as charge pump) to GND..............-0.3V to +15V

EN_OUT4, EN_OUT5, EN_OUT6, RESET, GPIO_

(configured as open-drain) to GND.....................-0.3V to +6V

EN_OUT_, RESET, GPIO_ (configured as push-pull)

DBP, ABP to GND .......................................-0.3V to minimum of

Continuous Current (all other pins)................................. Q20mA

Continuous Current (GND, pin 5).................................... Q30mA

32-Pin TQFN (derate 34.5mW/NC above +70NC)..... 2759mW*

Thermal Resistance (Note 1)

B

B

Operating Temperature Range.......................... -40NC to +85NC

Junction Temperature .....................................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

ELECTRICAL CHARACTERISTICS

ABSOLUTE MAXIMUM RATINGS

*As per JEDEC 51 Standard, Multilayer Board (PCB).

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Operating Voltage Range

RESET output asserted low

1.2

V

2.8

14

Undervoltage Lockout

device is flash configurable

2.7

V

Undervoltage Lockout Hysteresis

55

mV

Minimum Flash Operating Voltage

erase and write operations

2.7

V

Supply Current

No load on any output

2.8

4

mA

No load on any output, during flash writing

cycle

7.7

14

5

DBP Regulator Voltage

2.8

3

3.2

V

ABP Regulator Voltage

2.85

3

3.15

V

Boot Time

100

200

F

s

Flash Writing Time

8-byte word

122

ms

Internal Timing Accuracy

(Note 4)

-10

+10

%

ADC

Resolution

10

Bits

Gain Error

0.35

%

0.75

Offset Error

1.50

LSB

Integral Nonlinearity

1

LSB