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1PMT4124 Datasheet(PDF) 1 Page - Microsemi Corporation |
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1PMT4124 Datasheet(HTML) 1 Page - Microsemi Corporation |
1 / 4 page POWERMITE TM Low Noise 1 Watt Zener Diodes S C O T TS DALE DIVISION 1PMT4614e3 thru 1PMT4627e3, 1PMT4099e3 thru 1PMT4135e3 DESCRIPTION APPEARANCE This Microsemi Powermite ® surface mount low noise Zener package series provides a higher power handling capability that are also RoHS compliant. In addition to its size advantages, Powermite ® package features include a full-metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment. DO-216 IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com FEATURES APPLICATIONS / BENEFITS • Surface mount equivalent to JEDEC registered 1N4099 thru 1N4135 and 1N4614 thru 1N4627 series except with additional power capability • Extensive selection from 1.8 to 100 V • Regulates voltage over a broad operating current and temperature range • Low noise density (1-3 kHz) at test current • Low reverse leakage current • RoHS compliant • Tight tolerances available in plus or minus 2% or 1% with C or D suffix respectively • Moisture classification Level 1 per IPC/JEDEC J-STD-020B with no dry pack required • Nonsensitive to ESD per MIL-STD-750 Method 1020 • Compatible with automatic insertion equipment • Full metallic bottom eliminates flux entrapment MAXIMUM RATINGS MECHANICAL AND PACKAGING • Operating and Storage Temperatures: -55 °C to +150°C • Steady-State Power: 1.0 watt at TC < 120 oC where TC is case bottom temperature at mounting plane, or 0.5 watts at TA = 30 ºC (ambient temperature) when mounted on FR4 PC board as described for thermal resistance (also see power deratings in Figure 1) • Thermal Resistance: 30°C/W junction to case (bottom) and 240°C/W junction to ambient on FR4 PC board (1 oz copper) with recommended footprint (see last page) • Forward voltage: 1.1 Volts @ 200 mA • Solder Temperatures: 260°C for 10 s (max) • CASE: Void-free transfer molded thermosetting epoxy compound meeting UL94V-0 • FINISH: Annealed matte-Tin plating over copper and readily solderable per MIL-STD-750 method 2026 (consult factory for Tin-Lead plating) • POLARITY: Cathode designated by Tab 1 (bottom) • MARKING: Three numerical digits of P/N and a dot (see next page listing) • WEIGHT: 0.016 grams (approx.) • Package dimensions on last page • Tape & Reel option: Standard per EIA-481-B 3000 on 7 inch reel and 12,000 on 13” reel Microsemi Scottsdale Division Page 1 Copyright © 2007 10-15-2007 REV J 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503 |
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